X-ray mapping of metallic elements in roll bonded metal laminates

Wuhrer, R; Lee, M; Moran, K; Yeung, WY

X-ray mapping of metallic elements in roll bonded metal laminates

Wuhrer, R Lee, M Moran, K Yeung, WY

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Publication Type:: Journal Article
Citation:: Materials Forum, 2006, 30 pp. 225 - 232
Issue Date:: 2006-12-01

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Field	Value	Language
dc.contributor.author	Wuhrer, R	en_US
dc.contributor.author	Lee, M	en_US
dc.contributor.author	Moran, K	en_US
dc.contributor.author	Yeung, WY	en_US
dc.date.issued	2006-12-01	en_US
dc.identifier.citation	Materials Forum, 2006, 30 pp. 225 - 232	en_US
dc.identifier.issn	0883-2900	en_US
dc.identifier.uri	http://hdl.handle.net/10453/5693
dc.description.abstract	Advanced metal laminates have experienced rapid development in functional engineering applications. In this study, copper/aluminium metal laminates were produced by the roll bonding technique at 430°C with a critical 40% rolling reduction and sintering treatment was applied at 450°C. Interface development of the samples was examined using scanning electron microscopy and the distribution of the metallic elements and the subsequent chemical phase formation in the interfacial region was investigated by x-ray mapping. It was found that movement of the copper atoms occurred at a faster diffusion rate into the aluminium region and resulted in a shift of the interface boundary. Growth rate of the interface was determined and its relationship with sintering time was formulated. Development of the metallic phases in the interfacial area of the metal laminates was observed and determined. © Institute of Materials Engineering Australasia Ltd.	en_US
dc.relation.ispartof	Materials Forum	en_US
dc.title	X-ray mapping of metallic elements in roll bonded metal laminates	en_US
dc.type	Journal Article
utslib.citation.volume	30	en_US
utslib.for	091207 Metals and Alloy Materials	en_US
utslib.for	091202 Composite and Hybrid Materials	en_US
dc.location.activity	Bangkok, Thailand
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Science
utslib.copyright.status	open_access
pubs.publication-status	Published	en_US
pubs.volume	30	en_US

Abstract:

Advanced metal laminates have experienced rapid development in functional engineering applications. In this study, copper/aluminium metal laminates were produced by the roll bonding technique at 430°C with a critical 40% rolling reduction and sintering treatment was applied at 450°C. Interface development of the samples was examined using scanning electron microscopy and the distribution of the metallic elements and the subsequent chemical phase formation in the interfacial region was investigated by x-ray mapping. It was found that movement of the copper atoms occurred at a faster diffusion rate into the aluminium region and resulted in a shift of the interface boundary. Growth rate of the interface was determined and its relationship with sintering time was formulated. Development of the metallic phases in the interfacial area of the metal laminates was observed and determined. © Institute of Materials Engineering Australasia Ltd.

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http://hdl.handle.net/10453/5693