Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures

Publisher:
IEEE
Publication Type:
Conference Proceeding
Citation:
2012 IEEE International Interconnect Technology Conference, IITC 2012, 2012
Issue Date:
2012-10-01
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Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading conditions and a wide range of temperatures. © 2012 IEEE.
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