Interfacial strength development of roll-bonded aluminium/copper metal laminates

Publication Type:
Journal Article
Materials Science and Engineering A, 2008, 483-484 (1-2 C), pp. 740 - 742
Issue Date:
Full metadata record
Files in This Item:
Filename Description Size
Thumbnail2006008526OK.pdf328.85 kB
Adobe PDF
The development of the phases in the interface of roll-bonded Al/Cu metal laminates controls the strength. Phase development as a function of sintering time was monitored via X-ray diffraction and X-ray mapping. Both techniques revealed essentially the same phase presence and highlighted a limitation of X-ray diffraction. Initial rolling reduction has no effect on phase development but does affect the interface thickness. © 2007 Elsevier B.V. All rights reserved.
Please use this identifier to cite or link to this item: