A resonant method for determining the residual stress and elastic modulus of a thin film

Ma, S; Wang, S; Iacopi, F; Huang, H

A resonant method for determining the residual stress and elastic modulus of a thin film

Ma, S Wang, S Iacopi, F

Huang, H

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Publication Type:: Journal Article
Citation:: Applied Physics Letters, 2013, 103 (3)
Issue Date:: 2013-07-15

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Field	Value	Language
dc.contributor.author	Ma, S	en_US
dc.contributor.author	Wang, S	en_US
dc.contributor.author	Iacopi, F https://orcid.org/0000-0002-3196-0990	en_US
dc.contributor.author	Huang, H	en_US
dc.date.issued	2013-07-15	en_US
dc.identifier.citation	Applied Physics Letters, 2013, 103 (3)	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://hdl.handle.net/10453/117132
dc.description.abstract	By measuring the resonant frequencies of the first two symmetric vibration modes of a circular thin-film diaphragm and solving the Rayleigh-Ritz equation analytically, the residual stress and elastic modulus of the film were determined simultaneously. The results obtained employing this method are in excellent agreement with those obtained numerically in finite element modelling when tested using freestanding circular SiC diaphragms with residual tensile stress. The stress and modulus values are also in reasonably good agreement with those obtained from nanoindentation and wafer curvature measurements, respectively. © 2013 AIP Publishing LLC.	en_US
dc.relation.ispartof	Applied Physics Letters	en_US
dc.relation.isbasedon	10.1063/1.4813843	en_US
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject.classification	Applied Physics	en_US
dc.title	A resonant method for determining the residual stress and elastic modulus of a thin film	en_US
dc.type	Journal Article
utslib.citation.volume	3	en_US
utslib.citation.volume	103	en_US
utslib.for	0912 Materials Engineering	en_US
utslib.for	02 Physical Sciences	en_US
utslib.for	09 Engineering	en_US
utslib.for	10 Technology	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
pubs.issue	3	en_US
pubs.publication-status	Published	en_US
pubs.volume	103	en_US

Abstract:

By measuring the resonant frequencies of the first two symmetric vibration modes of a circular thin-film diaphragm and solving the Rayleigh-Ritz equation analytically, the residual stress and elastic modulus of the film were determined simultaneously. The results obtained employing this method are in excellent agreement with those obtained numerically in finite element modelling when tested using freestanding circular SiC diaphragms with residual tensile stress. The stress and modulus values are also in reasonably good agreement with those obtained from nanoindentation and wafer curvature measurements, respectively. © 2013 AIP Publishing LLC.

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http://hdl.handle.net/10453/117132