Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting

Ghodrat, M; Rhamdhani, MA; Khaliq, A; Brooks, G; Samali, B

Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting

Ghodrat, M Rhamdhani, MA Khaliq, A Brooks, G Samali, B

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Publication Type:: Journal Article
Citation:: Journal of Material Cycles and Waste Management, 2018, 20 (1), pp. 386 - 401
Issue Date:: 2018-01-01

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Field	Value	Language
dc.contributor.author	Ghodrat, M	en_US
dc.contributor.author	Rhamdhani, MA	en_US
dc.contributor.author	Khaliq, A	en_US
dc.contributor.author	Brooks, G	en_US
dc.contributor.author	Samali, B https://orcid.org/0000-0002-3426-7745	en_US
dc.date.issued	2018-01-01	en_US
dc.identifier.citation	Journal of Material Cycles and Waste Management, 2018, 20 (1), pp. 386 - 401	en_US
dc.identifier.issn	1438-4957	en_US
dc.identifier.uri	http://hdl.handle.net/10453/124961
dc.description.abstract	© 2017, Springer Japan. In this paper, a detailed thermodynamic analysis of processing of electronic waste (e-waste), particularly printed circuit boards (PCB), through secondary copper recycling (black copper smelting), was carried out. The mass balance flowsheets of two scenarios, i.e., the case of secondary copper recycling with (SCE1) and without (SCE2) addition of PCBs, have been developed and compared. From the perspective of recovery of copper (Cu), gold (Au), and silver (Ag); the thermodynamic analysis predicted that the process conditions at temperature of 1300 °C and oxygen partial pressure (pO2) of 10–8 atm are suitable for PCB processing through secondary copper smelting route. Under these conditions, no solid phases were predicted to form when the PCB addition is below 50 wt%. High PCB addition was predicted to produce high volume of slag in the process and more pollutants in the gas phase (Br-based gaseous compounds). The chemistry of the slag was also predicted to change that is shifting the liquidus temperature to a higher value due to the presence of aluminium (Al), silica (SiO2), and titanium dioxide (TiO2) in the feed coming from the PCB. The carbon content of the PCB potentially supplies additional heat and reductant (CO) in the process hence can partially replace coke in the feed material. The predicted recoveries of copper (Cu), gold (Au), and silver (Ag) from e-waste were 83.3, 96.5, and 88.5 wt% respectively.	en_US
dc.relation.ispartof	Journal of Material Cycles and Waste Management	en_US
dc.relation.isbasedon	10.1007/s10163-017-0590-8	en_US
dc.subject.classification	Environmental Sciences	en_US
dc.title	Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting	en_US
dc.type	Journal Article
utslib.citation.volume	1	en_US
utslib.citation.volume	20	en_US
utslib.for	0907 Environmental Engineering	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
utslib.copyright.status	closed_access
pubs.issue	1	en_US
pubs.publication-status	Published	en_US
pubs.volume	20	en_US

Abstract:

© 2017, Springer Japan. In this paper, a detailed thermodynamic analysis of processing of electronic waste (e-waste), particularly printed circuit boards (PCB), through secondary copper recycling (black copper smelting), was carried out. The mass balance flowsheets of two scenarios, i.e., the case of secondary copper recycling with (SCE1) and without (SCE2) addition of PCBs, have been developed and compared. From the perspective of recovery of copper (Cu), gold (Au), and silver (Ag); the thermodynamic analysis predicted that the process conditions at temperature of 1300 °C and oxygen partial pressure (pO2) of 10–8 atm are suitable for PCB processing through secondary copper smelting route. Under these conditions, no solid phases were predicted to form when the PCB addition is below 50 wt%. High PCB addition was predicted to produce high volume of slag in the process and more pollutants in the gas phase (Br-based gaseous compounds). The chemistry of the slag was also predicted to change that is shifting the liquidus temperature to a higher value due to the presence of aluminium (Al), silica (SiO2), and titanium dioxide (TiO2) in the feed coming from the PCB. The carbon content of the PCB potentially supplies additional heat and reductant (CO) in the process hence can partially replace coke in the feed material. The predicted recoveries of copper (Cu), gold (Au), and silver (Ag) from e-waste were 83.3, 96.5, and 88.5 wt% respectively.

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http://hdl.handle.net/10453/124961