Compact, Low-Profile, Bandwidth-Enhanced Substrate Integrated Waveguide Filtenna

Hu, KZ; Tang, MC; Li, M; Ziolkowski, RW

Compact, Low-Profile, Bandwidth-Enhanced Substrate Integrated Waveguide Filtenna

Hu, KZ Tang, MC Li, M Ziolkowski, RW

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Publication Type:: Journal Article
Citation:: IEEE Antennas and Wireless Propagation Letters, 2018, 17 (8), pp. 1552 - 1556
Issue Date:: 2018-08-01

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Field	Value	Language
dc.contributor.author	Hu, KZ	en_US
dc.contributor.author	Tang, MC	en_US
dc.contributor.author	Li, M	en_US
dc.contributor.author	Ziolkowski, RW https://orcid.org/0000-0003-4256-6902	en_US
dc.date.available	2020-07-31T19:12:26Z
dc.date.issued	2018-08-01	en_US
dc.identifier.citation	IEEE Antennas and Wireless Propagation Letters, 2018, 17 (8), pp. 1552 - 1556	en_US
dc.identifier.issn	1536-1225	en_US
dc.identifier.uri	http://hdl.handle.net/10453/129700
dc.description.abstract	© 2011 IEEE. In this letter, a compact, low-profile, bandwidth-enhanced, dual-cavity substrate integrated waveguide (SIW) filtenna is demonstrated. Two SIW cavities are stacked vertically on top of each other. A complementary split-ring resonator slot is etched in the top surface of the uppermost cavity, causing the top surface to act as a patch antenna. The operational impedance bandwidth is significantly enhanced by merging the three resonances that arise from this configuration. One is introduced by the patch, and the other two are inherently generated by the two cavities. A metallized coupling post is introduced from the ground plane through both cavities to the upper surface to excite the fundamental resonant mode of the patch, as well as to electromagnetically couple the two cavities. The optimized filtenna was fabricated by a standard printed circuit board technology and tested. It has a low profile λ 0 and a compact size 0.62λ 0×0.62λ0 at its center frequency, f0=2.95GHz. The measured results agree well with their simulated values. They demonstrate a 6.3% fractional bandwidth, a maximum realized gain of 6.73 dBi, a flat gain profile within its passband, and an excellent out-of-band selectivity.	en_US
dc.relation	http://purl.org/au-research/grants/arc/DP160102219
dc.relation.ispartof	IEEE Antennas and Wireless Propagation Letters	en_US
dc.relation.isbasedon	10.1109/LAWP.2018.2854898	en_US
dc.rights	info:eu-repo/semantics/openAccess
dc.subject.classification	Networking & Telecommunications	en_US
dc.title	Compact, Low-Profile, Bandwidth-Enhanced Substrate Integrated Waveguide Filtenna	en_US
dc.type	Journal Article
utslib.citation.volume	8	en_US
utslib.citation.volume	17	en_US
utslib.for	0906 Electrical and Electronic Engineering	en_US
utslib.for	1005 Communications Technologies	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
pubs.organisational-group	/University of Technology Sydney/Strength - GBDTC - Global Big Data Technologies
utslib.copyright.status	open_access	*
pubs.issue	8	en_US
pubs.publication-status	Published	en_US
pubs.volume	17	en_US

Abstract:

© 2011 IEEE. In this letter, a compact, low-profile, bandwidth-enhanced, dual-cavity substrate integrated waveguide (SIW) filtenna is demonstrated. Two SIW cavities are stacked vertically on top of each other. A complementary split-ring resonator slot is etched in the top surface of the uppermost cavity, causing the top surface to act as a patch antenna. The operational impedance bandwidth is significantly enhanced by merging the three resonances that arise from this configuration. One is introduced by the patch, and the other two are inherently generated by the two cavities. A metallized coupling post is introduced from the ground plane through both cavities to the upper surface to excite the fundamental resonant mode of the patch, as well as to electromagnetically couple the two cavities. The optimized filtenna was fabricated by a standard printed circuit board technology and tested. It has a low profile λ 0 and a compact size 0.62λ 0×0.62λ0 at its center frequency, f0=2.95GHz. The measured results agree well with their simulated values. They demonstrate a 6.3% fractional bandwidth, a maximum realized gain of 6.73 dBi, a flat gain profile within its passband, and an excellent out-of-band selectivity.

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http://hdl.handle.net/10453/129700