Comparative Survey of Techniques and Technologies Used in Transmit Path of Transmit Receive Module of AESA Radar

Saqib, M; Arif, MS; Akmal, R

Comparative Survey of Techniques and Technologies Used in Transmit Path of Transmit Receive Module of AESA Radar

Saqib, M Arif, MS Akmal, R

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Publication Type:: Conference Proceeding
Citation:: Proceedings of 2019 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019, 2019, pp. 1021 - 1028
Issue Date:: 2019-03-13

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Field	Value	Language
dc.contributor.author	Saqib, M	en_US
dc.contributor.author	Arif, MS	en_US
dc.contributor.author	Akmal, R	en_US
dc.date.accessioned	2019-07-11T05:16:52Z
dc.date.available	2019-07-11T05:16:52Z
dc.date.issued	2019-03-13	en_US
dc.identifier.citation	Proceedings of 2019 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019, 2019, pp. 1021 - 1028	en_US
dc.identifier.isbn	9781538677292	en_US
dc.identifier.uri	http://hdl.handle.net/10453/134535
dc.description.abstract	© 2019 IEEE. Technologies and topologies used in the design and fabrication of high power amplifiers are considered deciding factor in the size, cost and performance of Transmit / Receive modules (TRMs) of modern Active Electronically Scanned Array (AESA) radar. In this paper, a survey of contemporary semiconductor technologies like Si, SiC, GaAs, GaN, SiGe and InP for the design and fabrication of transmit path of TRM has been presented. TRM architectures and packaging technologies are also reviewed in terms of ease of implementation with optimum outcome. GaN MMIC has been found as the latest trending technology for TRM transmit path due to higher power densities, reliability, lower cost per watt production, and higher efficiencies with ease of implementation. Multiple MMICs integrated in suitable packaging technology-based hybrid approach has been found as one of the cost-effective solutions with high end results in the design of TRM.	en_US
dc.relation.ispartof	Proceedings of 2019 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019	en_US
dc.relation.isbasedon	10.1109/IBCAST.2019.8667234	en_US
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Comparative Survey of Techniques and Technologies Used in Transmit Path of Transmit Receive Module of AESA Radar	en_US
dc.type	Conference Proceeding
pubs.embargo.period	Not known	en_US
utslib.copyright.status	closed_access	*
pubs.declined	2019-07-11T15:16:52.261+1000
pubs.publication-status	Published	en_US

Abstract:

© 2019 IEEE. Technologies and topologies used in the design and fabrication of high power amplifiers are considered deciding factor in the size, cost and performance of Transmit / Receive modules (TRMs) of modern Active Electronically Scanned Array (AESA) radar. In this paper, a survey of contemporary semiconductor technologies like Si, SiC, GaAs, GaN, SiGe and InP for the design and fabrication of transmit path of TRM has been presented. TRM architectures and packaging technologies are also reviewed in terms of ease of implementation with optimum outcome. GaN MMIC has been found as the latest trending technology for TRM transmit path due to higher power densities, reliability, lower cost per watt production, and higher efficiencies with ease of implementation. Multiple MMICs integrated in suitable packaging technology-based hybrid approach has been found as one of the cost-effective solutions with high end results in the design of TRM.

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http://hdl.handle.net/10453/134535