Modeling and Analysis of Thermal Resistances and Thermal Coupling between Power Devices
- Publication Type:
- Journal Article
- Citation:
- IEEE Transactions on Electron Devices, 2019, 66 (10), pp. 4302 - 4308
- Issue Date:
- 2019-10-01
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| Filename | Description | Size | |||
|---|---|---|---|---|---|
| Modeling and Analysis of Thermal Resistances and Thermal Coupling Between Power Devices.pdf | Published Version | 3.2 MB |
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© 1963-2012 IEEE. The recent trend in the design of the high-power density power converter generally reduces the rate of the device cooling process. As a result, increased thermal coupling among devices exists. Based on measurements, a thermal coupling resistances network (TCRN) model is proposed in this article. Considering different spacings and current values at a fixed value of case temperature ( T _text c ), the relationships between the case-to-ambient thermal resistance ( R _text ca ) of individual power devices and their thermal coupling resistance ( R _text cp ) to the adjacent device are established. The close correspondence of T _text c from the calculation of the different spacing and experimental results obtained from a thermal coupling measurement platform confirms the established TCRN model and the relationships. Traditional thermal models do not consider the changes of R _text ca and also ignore the effect of thermal coupling among the adjacent devices. Compared with these models, the proposed thermal resistances modeling approach provides a better understanding of the thermal behavior of power devices.
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