Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

Chen, Z; Zhu, X; Xu, L

Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

Chen, Z Zhu, X

Xu, L

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Publisher:: IEEE
Publication Type:: Conference Proceeding
Citation:: Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC), 2020, 2019-December, pp. 1607-1609
Issue Date:: 2020

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Field	Value	Language
dc.contributor.author	Chen, Z
dc.contributor.author	Zhu, X https://orcid.org/0000-0002-5814-394X
dc.contributor.author	Xu, L
dc.date	2019-12-10
dc.date.accessioned	2021-05-10T04:10:37Z
dc.date.available	2021-05-10T04:10:37Z
dc.date.issued	2020
dc.identifier.citation	Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC), 2020, 2019-December, pp. 1607-1609
dc.identifier.isbn	9781728135175
dc.identifier.uri	http://hdl.handle.net/10453/148811
dc.description.abstract	© 2019 IEEE. This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm3, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.
dc.language	en
dc.publisher	IEEE
dc.relation.ispartof	Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC)
dc.relation.ispartof	IEEE Asia-Pacific Microwave Conference
dc.relation.isbasedon	10.1109/APMC46564.2019.9038285
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications
dc.type	Conference Proceeding
utslib.citation.volume	2019-December
utslib.location.activity	Singapore
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Strength - GBDTC - Global Big Data Technologies
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
pubs.consider-herdc	false
dc.date.updated	2021-05-10T04:10:36Z
pubs.finish-date	2019-12-13
pubs.publication-status	Published
pubs.start-date	2019-12-10
pubs.volume	2019-December

Abstract:

© 2019 IEEE. This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm3, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.

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http://hdl.handle.net/10453/148811