The impacts of material uncertainty in electro-migration of SAC solder electronic packaging by Monte Carlo based stochastic finite element model

Chu, L; Shi, J; Braun, R

The impacts of material uncertainty in electro-migration of SAC solder electronic packaging by Monte Carlo based stochastic finite element model

Chu, L Shi, J Braun, R

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Publisher:: Institute of Electrical and Electronics Engineers (IEEE)
Publication Type:: Journal Article
Citation:: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, PP, (99), pp. 1-1
Issue Date:: 2021-01-01

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Field	Value	Language
dc.contributor.author	Chu, L
dc.contributor.author	Shi, J
dc.contributor.author	Braun, R https://orcid.org/0000-0002-4153-8769
dc.date.accessioned	2021-09-28T02:17:08Z
dc.date.available	2021-09-28T02:17:08Z
dc.date.issued	2021-01-01
dc.identifier.citation	IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, PP, (99), pp. 1-1
dc.identifier.issn	2156-3950
dc.identifier.issn	2156-3985
dc.identifier.uri	http://hdl.handle.net/10453/150723
dc.description.abstract	Electro-migration (EM) induced by electric current under the conditions of multi-physical fields in integrated circuits and electronic packaging is a crucial factor that affects reliability and safety of the entire system. The uncertainty quantification and propagation in the EM process are the challenging issues that deserve more attention. In this paper, the uncertainties in the related material parameters of Sn-Ag-Cu (SAC) solder and copper conductors are taken into consideration based on the stochastic finite element model. The corners and edges of the contact surface in SAC solder are the most dynamic and active places with the maximum concentration gradient. This reaches a satisfied agreement with the experimental results and parallel numerical investigations in the literatures. The extreme values of the concentration and its gradient in each time step are computed and recorded. The accuracy and convergence of results are confirmed by the comparison of different period durations and time step scales with discrete time points. Furthermore, the probability density distribution, mean and variance of the extreme values in different time steps are recorded and compared. Based on the huge database provided by the Monte Carlo based stochastic finite element model (MC-SFEM), the correlations between the material parameters and the concentration as well as the concentration gradients are analyzed. The proposed MC-SFEM is a feasible and effective model for the comprehensive analysis of EM with the potential in uncertainty and reliability analysis.
dc.language	en
dc.publisher	Institute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartof	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.relation.isbasedon	10.1109/TCPMT.2021.3110969
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	The impacts of material uncertainty in electro-migration of SAC solder electronic packaging by Monte Carlo based stochastic finite element model
dc.type	Journal Article
utslib.citation.volume	PP
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Strength - CRIN - Realtime Information Networks
pubs.organisational-group	/University of Technology Sydney/Strength - GBDTC - Global Big Data Technologies
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2021-09-28T02:17:06Z
pubs.issue	99
pubs.publication-status	Published
pubs.volume	PP
utslib.citation.issue	99

Abstract:

Electro-migration (EM) induced by electric current under the conditions of multi-physical fields in integrated circuits and electronic packaging is a crucial factor that affects reliability and safety of the entire system. The uncertainty quantification and propagation in the EM process are the challenging issues that deserve more attention. In this paper, the uncertainties in the related material parameters of Sn-Ag-Cu (SAC) solder and copper conductors are taken into consideration based on the stochastic finite element model. The corners and edges of the contact surface in SAC solder are the most dynamic and active places with the maximum concentration gradient. This reaches a satisfied agreement with the experimental results and parallel numerical investigations in the literatures. The extreme values of the concentration and its gradient in each time step are computed and recorded. The accuracy and convergence of results are confirmed by the comparison of different period durations and time step scales with discrete time points. Furthermore, the probability density distribution, mean and variance of the extreme values in different time steps are recorded and compared. Based on the huge database provided by the Monte Carlo based stochastic finite element model (MC-SFEM), the correlations between the material parameters and the concentration as well as the concentration gradients are analyzed. The proposed MC-SFEM is a feasible and effective model for the comprehensive analysis of EM with the potential in uncertainty and reliability analysis.

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http://hdl.handle.net/10453/150723