Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging under Random Shear Stress and Thermal Temperature

Chu, L; Zhou, P; Shi, J; Braun, R

Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging under Random Shear Stress and Thermal Temperature

Chu, L Zhou, P Shi, J Braun, R

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Publisher:: Institute of Electrical and Electronics Engineers
Publication Type:: Journal Article
Citation:: IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2021, 11, (5), pp. 765-777
Issue Date:: 2021-05-01

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Field	Value	Language
dc.contributor.author	Chu, L
dc.contributor.author	Zhou, P
dc.contributor.author	Shi, J
dc.contributor.author	Braun, R https://orcid.org/0000-0002-4153-8769
dc.date.accessioned	2022-05-19T02:06:37Z
dc.date.available	2022-05-19T02:06:37Z
dc.date.issued	2021-05-01
dc.identifier.citation	IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2021, 11, (5), pp. 765-777
dc.identifier.issn	2156-3950
dc.identifier.issn	2156-3985
dc.identifier.uri	http://hdl.handle.net/10453/157516
dc.description.abstract	The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packaging due to its feasibility in high density integrated circuits and convenience in the product design process. However, the effects of geometrical parameters on the product reliability and safety under complicated operating situations are not clear. In this article, an independent solder ball and four typical BGA cases are compared and analyzed based on the finite element (FE) method. The coupled random shear stress and thermal temperature are simulated in the FE models by the Latin hypercube sampling (LHS) method. According to the sensitivity analysis, the edges of the solder ball are the most dangerous places, which has the qualitative agreement with the experimental results. The complete grid array in the first BGA case with homogeneous stress and strain distribution is the most reliable and competitive design. Furthermore, the normal and Weibull distributions are not suitable to present the stochastic response of solder balls in flip-chip packaging under random coupled mechanical and thermal stress. In order to effectively improve packaging performance and reliability, the radius of the solder ball acts as the key factor, while the upper and lower height of the solder ball, as well as the pitch along the X - and Y -directions, are all feasible and potential for the geometrical optimization. However, the small scale of the solder ball causing microstress concentration points and discontinuous volumes is the essential challenge for industrial manufacturing. The work in this article provides helpful references to the industrial electronic package geometrical optimal design.
dc.language	English
dc.publisher	Institute of Electrical and Electronics Engineers
dc.relation.ispartof	IEEE Transactions on Components, Packaging, and Manufacturing Technology
dc.relation.isbasedon	10.1109/TCPMT.2021.3056218
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging under Random Shear Stress and Thermal Temperature
dc.type	Journal Article
utslib.citation.volume	11
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Strength - CRIN - Realtime Information Networks
pubs.organisational-group	/University of Technology Sydney/Strength - GBDTC - Global Big Data Technologies
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
pubs.consider-herdc	false
dc.date.updated	2022-05-19T02:06:34Z
pubs.issue	5
pubs.publication-status	Published
pubs.volume	11
utslib.citation.issue	5

Abstract:

The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packaging due to its feasibility in high density integrated circuits and convenience in the product design process. However, the effects of geometrical parameters on the product reliability and safety under complicated operating situations are not clear. In this article, an independent solder ball and four typical BGA cases are compared and analyzed based on the finite element (FE) method. The coupled random shear stress and thermal temperature are simulated in the FE models by the Latin hypercube sampling (LHS) method. According to the sensitivity analysis, the edges of the solder ball are the most dangerous places, which has the qualitative agreement with the experimental results. The complete grid array in the first BGA case with homogeneous stress and strain distribution is the most reliable and competitive design. Furthermore, the normal and Weibull distributions are not suitable to present the stochastic response of solder balls in flip-chip packaging under random coupled mechanical and thermal stress. In order to effectively improve packaging performance and reliability, the radius of the solder ball acts as the key factor, while the upper and lower height of the solder ball, as well as the pitch along the X - and Y -directions, are all feasible and potential for the geometrical optimization. However, the small scale of the solder ball causing microstress concentration points and discontinuous volumes is the essential challenge for industrial manufacturing. The work in this article provides helpful references to the industrial electronic package geometrical optimal design.

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http://hdl.handle.net/10453/157516