Monte Carlo based stochastic finite element model for uncertainty quantification in flip chip BGA electronic packaging
- Publication Type:
- Conference Proceeding
- 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 00, pp. 1-4
- Issue Date:
|Monte_Carlo_based_stochastic_finite_element_model_for_uncertainty_quantification_in_flip_chip_BGA_electronic_packaging.pdf||Published version||6.43 MB|
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The Ball grid array (BGA) electronic packaging method is an efficient and appropriate way for high density integrated circuits. The uncertainties in the material and geometrical parameters to product reliability and safety under the real operating situation are the crucial issues deserved more attention. In this paper, the Monte Carlo based stochastic finite element model (MC-SFEM) is proposed for uncertainty quantification in flip chip BGA electronic packaging. The Monte Carlo stochastic sampling process is combined with the finite element computation for the resonant frequencies response of the flip chip BGA electronic packaging. The uncertainties in material and geometrical parameters of flip chip BGA electronic packaging are performed and propagated by advanced Monte Carlo method (Latin Hypercube sampling method). Four different BGA configurations are compared and discussed. The proposed model and the computational results in this paper provide meaningful references to the electronic package reliability prediction.
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