Atomically Thin Hexagonal Boron Nitride Nanofilm for Cu Protection: The Importance of Film Perfection.

Khan, MH; Jamali, SS; Lyalin, A; Molino, PJ; Jiang, L; Liu, HK; Taketsugu, T; Huang, Z

Atomically Thin Hexagonal Boron Nitride Nanofilm for Cu Protection: The Importance of Film Perfection.

Khan, MH Jamali, SS Lyalin, A Molino, PJ Jiang, L Liu, HK Taketsugu, T Huang, Z

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Publisher:: Wiley
Publication Type:: Journal Article
Citation:: Advanced Materials, 2017, 29, (4), pp. 1-7
Issue Date:: 2017-01

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Field	Value	Language
dc.contributor.author	Khan, MH
dc.contributor.author	Jamali, SS
dc.contributor.author	Lyalin, A
dc.contributor.author	Molino, PJ
dc.contributor.author	Jiang, L
dc.contributor.author	Liu, HK
dc.contributor.author	Taketsugu, T
dc.contributor.author	Huang, Z https://orcid.org/0000-0003-1985-0884
dc.date.accessioned	2022-08-05T01:49:11Z
dc.date.available	2022-08-05T01:49:11Z
dc.date.issued	2017-01
dc.identifier.citation	Advanced Materials, 2017, 29, (4), pp. 1-7
dc.identifier.issn	0935-9648
dc.identifier.issn	1521-4095
dc.identifier.uri	http://hdl.handle.net/10453/159633
dc.description.abstract	Outstanding protection of Cu by high-quality boron nitride nanofilm (BNNF) 1-2 atomic layers thick in salt water is observed, while defective BNNF accelerates the reaction of Cu toward water. The chemical stability, insulating nature, and impermeability of ions through the BN hexagons render BNNF a great choice for atomic-scale protection.
dc.format	Print-Electronic
dc.language	eng
dc.publisher	Wiley
dc.relation.ispartof	Advanced Materials
dc.relation.isbasedon	10.1002/adma.201603937
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject	02 Physical Sciences, 03 Chemical Sciences, 09 Engineering
dc.subject.classification	Nanoscience & Nanotechnology
dc.title	Atomically Thin Hexagonal Boron Nitride Nanofilm for Cu Protection: The Importance of Film Perfection.
dc.type	Journal Article
utslib.citation.volume	29
utslib.location.activity	Germany
utslib.for	02 Physical Sciences
utslib.for	03 Chemical Sciences
utslib.for	09 Engineering
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Civil and Environmental Engineering
pubs.organisational-group	/University of Technology Sydney/Strength - CTWW - Centre for Technology in Water and Wastewater Treatment
utslib.copyright.status	closed_access	*
pubs.consider-herdc	false
dc.date.updated	2022-08-05T01:49:09Z
pubs.issue	4
pubs.publication-status	Published
pubs.volume	29
utslib.citation.issue	4

Abstract:

Outstanding protection of Cu by high-quality boron nitride nanofilm (BNNF) 1-2 atomic layers thick in salt water is observed, while defective BNNF accelerates the reaction of Cu toward water. The chemical stability, insulating nature, and impermeability of ions through the BN hexagons render BNNF a great choice for atomic-scale protection.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/159633