TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems
- Publisher:
- Institute of Electrical and Electronics Engineers (IEEE)
- Publication Type:
- Journal Article
- Citation:
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2019, 28, (3), pp. 672-685
- Issue Date:
- 2019-11-07
Closed Access
Filename | Description | Size | |||
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025_Rev (2).pdf | Published version | 327.65 kB |
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