TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems

Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publication Type:
Journal Article
Citation:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2019, 28, (3), pp. 672-685
Issue Date:
2019-11-07
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