A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems

Dang, KN Ahmed, AB Abdallah, AB Tran, X-T

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Field	Value	Language
dc.contributor.author	Dang, KN
dc.contributor.author	Ahmed, AB
dc.contributor.author	Abdallah, AB
dc.contributor.author	Tran, X-T
dc.date.accessioned	2022-10-31T02:53:24Z
dc.date.available	2022-10-31T02:53:24Z
dc.date.issued	2020-01-01
dc.identifier.citation	IEEE Access, 2020, 8, pp. 166642-166657
dc.identifier.issn	2169-3536
dc.identifier.issn	2169-3536
dc.identifier.uri	http://hdl.handle.net/10453/163036
dc.language	en
dc.publisher	Institute of Electrical and Electronics Engineers
dc.relation.ispartof	IEEE Access
dc.relation.isbasedon	10.1109/access.2020.3022904
dc.rights	info:eu-repo/semantics/openAccess
dc.subject	08 Information and Computing Sciences, 09 Engineering, 10 Technology
dc.title	A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems
dc.type	Journal Article
utslib.citation.volume	8
utslib.for	08 Information and Computing Sciences
utslib.for	09 Engineering
utslib.for	10 Technology
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	open_access	*
pubs.consider-herdc	false
dc.date.updated	2022-10-31T02:53:22Z
pubs.publication-status	Published
pubs.volume	8

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