Tunable Size of Hierarchically Porous Alumina Ceramics Based on DIW 3D Printing Supramolecular Gel.

Yang, G; Guan, R; Zhen, H; Ou, K; Fang, J; Li, D-S; Fu, Q; Sun, Y

Tunable Size of Hierarchically Porous Alumina Ceramics Based on DIW 3D Printing Supramolecular Gel.

Yang, G Guan, R Zhen, H Ou, K Fang, J Li, D-S Fu, Q

Sun, Y

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Publisher:: AMER CHEMICAL SOC
Publication Type:: Journal Article
Citation:: ACS Appl Mater Interfaces, 2022, 14, (8), pp. 10998-11005
Issue Date:: 2022-03-02

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Field	Value	Language
dc.contributor.author	Yang, G
dc.contributor.author	Guan, R
dc.contributor.author	Zhen, H
dc.contributor.author	Ou, K
dc.contributor.author	Fang, J
dc.contributor.author	Li, D-S
dc.contributor.author	Fu, Q https://orcid.org/0000-0002-4012-330X
dc.contributor.author	Sun, Y
dc.date.accessioned	2022-12-07T21:20:56Z
dc.date.available	2022-12-07T21:20:56Z
dc.date.issued	2022-03-02
dc.identifier.citation	ACS Appl Mater Interfaces, 2022, 14, (8), pp. 10998-11005
dc.identifier.issn	1944-8244
dc.identifier.issn	1944-8252
dc.identifier.uri	http://hdl.handle.net/10453/164230
dc.description.abstract	A new three-dimensional (3D) printing gel is developed to construct hierarchically porous ceramics with adjustable millimeter-, micrometer-, and nanometer-scale size for application in thermal management. Not only does the gel based on supramolecular micelles exhibit excellent DIW 3D printability but also the supramolecular micelles act as templates that can precisely control the structure of micrometer-scale pores. The effect of millimeter- and μmicrometer-scale size on properties of porous ceramics is investigated in detail. The 3D-printed ceramic foam with millimeter-scale pores and smaller micrometer-scale pores shows better thermal insulation and lower compressive strength. For the thermal insulation, the local temperature of a chip exposed to contact heat is only 34.2 °C in the presence of a printed foam cap with a pore size of 41.5 μm, while the local temperature is 54.8 °C in the absence of the printed foam cap. The study provides a new method to construct hierarchically porous alumina ceramics with precisely tunable size, avoiding the issues of subtractive manufacturing and opening up new applications in portable devices or consumer electronics.
dc.format	Print-Electronic
dc.language	eng
dc.publisher	AMER CHEMICAL SOC
dc.relation.ispartof	ACS Appl Mater Interfaces
dc.relation.isbasedon	10.1021/acsami.1c24090
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject	03 Chemical Sciences, 09 Engineering
dc.subject.classification	Nanoscience & Nanotechnology
dc.title	Tunable Size of Hierarchically Porous Alumina Ceramics Based on DIW 3D Printing Supramolecular Gel.
dc.type	Journal Article
utslib.citation.volume	14
utslib.location.activity	United States
utslib.for	03 Chemical Sciences
utslib.for	09 Engineering
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Civil and Environmental Engineering
pubs.organisational-group	/University of Technology Sydney/Strength - CTWW - Centre for Technology in Water and Wastewater Treatment
utslib.copyright.status	closed_access	*
dc.date.updated	2022-12-07T21:20:04Z
pubs.issue	8
pubs.publication-status	Published
pubs.volume	14
utslib.citation.issue	8

Abstract:

A new three-dimensional (3D) printing gel is developed to construct hierarchically porous ceramics with adjustable millimeter-, micrometer-, and nanometer-scale size for application in thermal management. Not only does the gel based on supramolecular micelles exhibit excellent DIW 3D printability but also the supramolecular micelles act as templates that can precisely control the structure of micrometer-scale pores. The effect of millimeter- and μmicrometer-scale size on properties of porous ceramics is investigated in detail. The 3D-printed ceramic foam with millimeter-scale pores and smaller micrometer-scale pores shows better thermal insulation and lower compressive strength. For the thermal insulation, the local temperature of a chip exposed to contact heat is only 34.2 °C in the presence of a printed foam cap with a pore size of 41.5 μm, while the local temperature is 54.8 °C in the absence of the printed foam cap. The study provides a new method to construct hierarchically porous alumina ceramics with precisely tunable size, avoiding the issues of subtractive manufacturing and opening up new applications in portable devices or consumer electronics.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/164230