Materialising Memories

van den Hoven, E

Materialising Memories

van den Hoven, E

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Publisher:: ACM Books
Publication Type:: Chapter
Citation:: Weaving Fire Into Form Aspirations for Tangible and Embodied Interaction, 2022, #44, pp. 111-113
Issue Date:: 2022-07-13

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Field	Value	Language
dc.contributor.author	van den Hoven, E https://orcid.org/0000-0002-0888-1426
dc.contributor.editor	Ullmer, B
dc.contributor.editor	Shaer, O
dc.contributor.editor	Mazalek, A
dc.contributor.editor	Hummels, C
dc.date.accessioned	2023-01-03T23:10:00Z
dc.date.available	2023-01-03T23:10:00Z
dc.date.issued	2022-07-13
dc.identifier.citation	Weaving Fire Into Form Aspirations for Tangible and Embodied Interaction, 2022, #44, pp. 111-113
dc.identifier.isbn	1450397697
dc.identifier.isbn	9781450397698
dc.identifier.uri	http://hdl.handle.net/10453/164661
dc.description.abstract	This book investigates multiple facets of the emerging discipline of Tangible, Embodied, and Embedded Interaction (TEI). This is a story of atoms and bits.
dc.format.extent	27
dc.language	en
dc.publisher	ACM Books
dc.relation.ispartof	Weaving Fire Into Form Aspirations for Tangible and Embodied Interaction
dc.relation.ispartofseries	ACM Books
dc.rights	info:eu-repo/semantics/openAccess
dc.title	Materialising Memories
dc.type	Chapter
utslib.citation.edition	#44
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Strength - CCDP - Contemporary Design Practice
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Computer Science
utslib.copyright.status	open_access	*
pubs.consider-herdc	true
dc.date.updated	2023-01-03T23:09:59Z
pubs.edition	#44
pubs.place-of-publication	New York, USA
pubs.publication-status	Published
dc.location	New York, USA

Abstract:

This book investigates multiple facets of the emerging discipline of Tangible, Embodied, and Embedded Interaction (TEI). This is a story of atoms and bits.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/164661