3D Broadband FSS with Through Holes and Low Profile for UHF and SHF Applications

Li, M; Liu, J; Hu, Z; Yang, Y

3D Broadband FSS with Through Holes and Low Profile for UHF and SHF Applications

Li, M Liu, J Hu, Z Yang, Y

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Publisher:: Institute of Electrical and Electronics Engineers (IEEE)
Publication Type:: Conference Proceeding
Citation:: 2022 International Symposium on Antennas and Propagation, ISAP 2022, 2022, 00, pp. 443-444
Issue Date:: 2022-01-01

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Field	Value	Language
dc.contributor.author	Li, M
dc.contributor.author	Liu, J
dc.contributor.author	Hu, Z
dc.contributor.author	Yang, Y https://orcid.org/0000-0001-7439-2156
dc.date	2022-10-31
dc.date.accessioned	2023-03-24T02:32:28Z
dc.date.available	2023-03-24T02:32:28Z
dc.date.issued	2022-01-01
dc.identifier.citation	2022 International Symposium on Antennas and Propagation, ISAP 2022, 2022, 00, pp. 443-444
dc.identifier.isbn	9781665479622
dc.identifier.uri	http://hdl.handle.net/10453/168308
dc.description.abstract	Modern communication systems need low-frequency devices with high gain and wide operational bands. This paper proposes a frequency selective surface (FSS) with a wide passband and low profile, which can be additively manufactured. Each unit of the FSS consists of a centre cube and four surrounding walls with two metal layers covering the top and bottom sides. Through drills are introduced in the design to improve the return loss and the insertion loss in the operational band. The proposed FSS prototype is designed and can be fabricated in a single substrate with a multi-material additively manufacturing technology, and its performance is verified in simulation. It resonates at 3.75 GHz with a fractional bandwidth of 29.3%. Good out-of-band suppression is obtained as well
dc.language	en
dc.publisher	Institute of Electrical and Electronics Engineers (IEEE)
dc.relation	Department of Industry, Innovation and ScienceICG001899
dc.relation.ispartof	2022 International Symposium on Antennas and Propagation, ISAP 2022
dc.relation.ispartof	2022 International Symposium on Antennas and Propagation (ISAP)
dc.relation.isbasedon	10.1109/ISAP53582.2022.9998777
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	3D Broadband FSS with Through Holes and Low Profile for UHF and SHF Applications
dc.type	Conference Proceeding
utslib.citation.volume	00
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2023-03-24T02:32:27Z
pubs.finish-date	2022-11-03
pubs.publication-status	Published
pubs.start-date	2022-10-31
pubs.volume	00

Abstract:

Modern communication systems need low-frequency devices with high gain and wide operational bands. This paper proposes a frequency selective surface (FSS) with a wide passband and low profile, which can be additively manufactured. Each unit of the FSS consists of a centre cube and four surrounding walls with two metal layers covering the top and bottom sides. Through drills are introduced in the design to improve the return loss and the insertion loss in the operational band. The proposed FSS prototype is designed and can be fabricated in a single substrate with a multi-material additively manufacturing technology, and its performance is verified in simulation. It resonates at 3.75 GHz with a fractional bandwidth of 29.3%. Good out-of-band suppression is obtained as well

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http://hdl.handle.net/10453/168308