Unique multi -level metal layer electronics solutions offered by advanced 3D printing

Li, M; Yang, Y; Nulman, J; Yamada, M; Iacopi, F

Unique multi -level metal layer electronics solutions offered by advanced 3D printing

Li, M Yang, Y

Nulman, J Yamada, M Iacopi, F

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Publisher:: IEEE
Publication Type:: Conference Proceeding
Citation:: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2022, 00, pp. 144-144
Issue Date:: 2022-06-21

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Field	Value	Language
dc.contributor.author	Li, M
dc.contributor.author	Yang, Y https://orcid.org/0000-0001-7439-2156
dc.contributor.author	Nulman, J
dc.contributor.author	Yamada, M
dc.contributor.author	Iacopi, F https://orcid.org/0000-0002-3196-0990
dc.date	2022-03-06
dc.date.accessioned	2023-04-11T03:30:08Z
dc.date.available	2023-04-11T03:30:08Z
dc.date.issued	2022-06-21
dc.identifier.citation	2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2022, 00, pp. 144-144
dc.identifier.uri	http://hdl.handle.net/10453/169540
dc.description.abstract	Integrated additively manufactured electronics (AME) is a novel manufacturing technique enabled by the recent progress in simultaneous 3D printing of dielectric materials and conductive inks with flexible interlayer distance. This capability allows for the realization of complex passive electronics and antenna elements as a one-stop-shop for circuit-in-package applications. Specifically, we will address the capabilities of the DragonFlyTM LDM system to realize high-frequency applications such as multilayer bandpass filters [1], and multi-layer stacked antennas for millimeter-wave with superior integration capabilities to achieve smaller form factors [2], but also to enable the realization of vertically stacked metamaterial approaches [3]. In addition, the fabrication can take place at low temperature.
dc.language	en
dc.publisher	IEEE
dc.relation.ispartof	2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
dc.relation.ispartof	2022 6th IEEE Electron Devices Technology and Manufacturing Conference
dc.relation.isbasedon	10.1109/edtm53872.2022.9798133
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Unique multi -level metal layer electronics solutions offered by advanced 3D printing
dc.type	Conference Proceeding
utslib.citation.volume	00
utslib.location.activity	Oita, Japan
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2023-04-11T03:30:07Z
pubs.finish-date	2022-03-09
pubs.publication-status	Published
pubs.start-date	2022-03-06
pubs.volume	00

Abstract:

Integrated additively manufactured electronics (AME) is a novel manufacturing technique enabled by the recent progress in simultaneous 3D printing of dielectric materials and conductive inks with flexible interlayer distance. This capability allows for the realization of complex passive electronics and antenna elements as a one-stop-shop for circuit-in-package applications. Specifically, we will address the capabilities of the DragonFlyTM LDM system to realize high-frequency applications such as multilayer bandpass filters [1], and multi-layer stacked antennas for millimeter-wave with superior integration capabilities to achieve smaller form factors [2], but also to enable the realization of vertically stacked metamaterial approaches [3]. In addition, the fabrication can take place at low temperature.

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http://hdl.handle.net/10453/169540