Preface

Iacopi, F

Balestra, F

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Publication Type:: Journal Article
Citation:: More-than-Moore Devices and Integration for Semi Conductors, 2023, pp. v-x
Issue Date:: 2023-01-01

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Field	Value	Language
dc.contributor.author	Iacopi, F https://orcid.org/0000-0002-3196-0990
dc.contributor.author	Balestra, F
dc.date.accessioned	2023-06-09T07:52:33Z
dc.date.available	2023-06-09T07:52:33Z
dc.date.issued	2023-01-01
dc.identifier.citation	More-than-Moore Devices and Integration for Semi Conductors, 2023, pp. v-x
dc.identifier.isbn	9783031216091
dc.identifier.uri	http://hdl.handle.net/10453/170683
dc.language	en
dc.relation.ispartof	More-than-Moore Devices and Integration for Semi Conductors
dc.rights	info:eu-repo/semantics/openAccess
dc.rights	This is a post-peer-review, pre-copyedit version of a chapter published in [More-than-Moore Devices and Integration for Semi Conductors, 2023, pp. v-x]. The final authenticated version is available online at https://link.springer.com/book/10.1007/978-3-031-21610-7]”
dc.title	Preface
dc.type	Journal Article
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	open_access	*
dc.date.updated	2023-06-09T07:52:32Z
pubs.publication-status	Published

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