Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration

Lau, JH; Lin, C; Liu, H-N; Yang, K-M; Xia, T; Ko, C-T; Lin, BP; Chuang, Y-L; Chen, R; Ma, M; Tseng, T-J; Li, M; Leung, K

Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration

Lau, JH Lin, C Liu, H-N Yang, K-M Xia, T Ko, C-T Lin, BP Chuang, Y-L Chen, R Ma, M Tseng, T-J Li, M

Leung, K

Permalink

Publisher:: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Publication Type:: Journal Article
Citation:: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13, (9), pp. 1371-1379
Issue Date:: 2023-09

Closed Access

	Filename	Description	Size
	Hybrid_Substrate_With_Ultralarge_Organic_Interposer_for_Heterogeneous_Integration.pdf	Published version	2.26 MB	Adobe PDF	View/Open

Copyright Clearance Process

Recently Added
In Progress
Closed Access

This item is closed access and not available.

Full metadata record

Field	Value	Language
dc.contributor.author	Lau, JH
dc.contributor.author	Lin, C
dc.contributor.author	Liu, H-N
dc.contributor.author	Yang, K-M
dc.contributor.author	Xia, T
dc.contributor.author	Ko, C-T
dc.contributor.author	Lin, BP
dc.contributor.author	Chuang, Y-L
dc.contributor.author	Chen, R
dc.contributor.author	Ma, M
dc.contributor.author	Tseng, T-J
dc.contributor.author	Li, M https://orcid.org/0000-0002-2268-9334
dc.contributor.author	Leung, K
dc.date.accessioned	2024-04-26T06:47:09Z
dc.date.available	2024-04-26T06:47:09Z
dc.date.issued	2023-09
dc.identifier.citation	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13, (9), pp. 1371-1379
dc.identifier.issn	2156-3950
dc.identifier.issn	2156-3985
dc.identifier.uri	http://hdl.handle.net/10453/178398
dc.language	English
dc.publisher	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.relation.ispartof	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.relation.isbasedon	10.1109/TCPMT.2023.3305099
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject.classification	4009 Electronics, sensors and digital hardware
dc.subject.classification	4014 Manufacturing engineering
dc.title	Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration
dc.type	Journal Article
utslib.citation.volume	13
pubs.organisational-group	University of Technology Sydney
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2024-04-26T06:47:07Z
pubs.issue	9
pubs.publication-status	Published
pubs.volume	13
utslib.citation.issue	9

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/178398