Recent Advances in On-Chip Silicon-based Passive Components for RF and Millimeter-Wave Applications

Ang, JD; Zhu, X

Recent Advances in On-Chip Silicon-based Passive Components for RF and Millimeter-Wave Applications

Ang, JD Zhu, X

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Publisher:: Institute of Electrical and Electronics Engineers (IEEE)
Publication Type:: Conference Proceeding
Citation:: IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings, 2023, 00, pp. 1-3
Issue Date:: 2023-01-01

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Field	Value	Language
dc.contributor.author	Ang, JD
dc.contributor.author	Zhu, X https://orcid.org/0000-0002-5814-394X
dc.date	2022-11-27
dc.date.accessioned	2024-05-03T02:01:58Z
dc.date.available	2024-05-03T02:01:58Z
dc.date.issued	2023-01-01
dc.identifier.citation	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings, 2023, 00, pp. 1-3
dc.identifier.isbn	9781665478342
dc.identifier.uri	http://hdl.handle.net/10453/178577
dc.description.abstract	In this brief, an overview of recently published works related to on-chip passive components will be given. As the full potential of CMOS-based active devices has almost reached, it is more important to start looking into passive-inspired designs, which have a potential to demonstrate the performance of the silicon-based RF circuits beyond Moore's Law. In particular, design of minimized passive components, reflectionless filters and passive/active co-designs will be summarized.
dc.language	en
dc.publisher	Institute of Electrical and Electronics Engineers (IEEE)
dc.relation	http://purl.org/au-research/grants/arc/LP200301506
dc.relation	http://purl.org/au-research/grants/arc/LP210100378
dc.relation	Department of Industry, Innovation and ScienceICG001429
dc.relation.ispartof	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings
dc.relation.ispartof	International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications
dc.relation.isbasedon	10.1109/IMWS-AMP54652.2022.10106928
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Recent Advances in On-Chip Silicon-based Passive Components for RF and Millimeter-Wave Applications
dc.type	Conference Proceeding
utslib.citation.volume	00
utslib.location.activity	Guangzhou, China
pubs.organisational-group	University of Technology Sydney
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	University of Technology Sydney/Strength - GBDTC - Global Big Data Technologies
pubs.organisational-group	University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering
utslib.copyright.status	closed_access	*
pubs.consider-herdc	false
dc.date.updated	2024-05-03T02:01:56Z
pubs.finish-date	2022-11-29
pubs.publication-status	Published
pubs.start-date	2022-11-27
pubs.volume	00

Abstract:

In this brief, an overview of recently published works related to on-chip passive components will be given. As the full potential of CMOS-based active devices has almost reached, it is more important to start looking into passive-inspired designs, which have a potential to demonstrate the performance of the silicon-based RF circuits beyond Moore's Law. In particular, design of minimized passive components, reflectionless filters and passive/active co-designs will be summarized.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/178577