Color Biological Features-based Solder Paste Defects Detection And Classification On Printed Circuit Boards

Publisher:
IEEE-inst Electrical Electronics Engineers Inc
Publication Type:
Journal Article
Citation:
IEEE Transactions on Components, Packaging, and Manufaturing Technology, 2012, 2 (9), pp. 1536 - 1544
Issue Date:
2012-01
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Deposited solder paste inspection plays a critical role in surface mounting processes. When detecting solder pastes defects on a printed circuit board, profile measurement-based methods suffer from large system size, high cost, and low speed for inspecti
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