Numerical Study on Springback with Size Effect in Micro V-bending

Publication Type:
Conference Proceeding
Citation:
Procedia Engineering, 2014, 81 pp. 1011 - 1016
Issue Date:
2014
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With the development of microforming technology, the demand on accuracy of the metallic micro components is elevating. While springback phenomenon which is inevitable during bending process, can cause unpredicted dimensional error, bringing difficulties to the downstream assembly, and let alone the springback in microforming as the measurements of tools and workpieces downsize hundreds even thousands times. This paper focuses on the springback effect that occurs after the micro V-bending a classic processing method to manufacture microparts. Numerical simulation has been conducted to investigate the size effect in terms of Voronoi tessellation and springback. A finite element (FE) model of the micro V-bending has been established by utilising ABAQUS/Standard commercial software. The grain sizes of 98, 152 and 201 μm have been adopted in FE model to study the relationship between the size effect and springback angle during the V-bending process.
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