Numerical study on springback with size effect in micro V-bending

Fang, Z; Lu, H; Wei, D; Jiang, Z; Zhao, X; Zhang, X; Wu, D

Numerical study on springback with size effect in micro V-bending

Fang, Z Lu, H Wei, D

Jiang, Z Zhao, X Zhang, X Wu, D

Permalink

Publication Type:: Journal Article
Citation:: Procedia Engineering, 2014, 81 pp. 1011 - 1016
Issue Date:: 2014-01-01

Open Access

Copyright Clearance Process

Recently Added
In Progress
Open Access

This item is open access.

Adobe PDF

Download Published versionAdobe PDF (1 MB)

View on publisher's site

View statistics

Full metadata record

Field	Value	Language
dc.contributor.author	Fang, Z	en_US
dc.contributor.author	Lu, H	en_US
dc.contributor.author	Wei, D https://orcid.org/0000-0002-4247-8905	en_US
dc.contributor.author	Jiang, Z	en_US
dc.contributor.author	Zhao, X	en_US
dc.contributor.author	Zhang, X	en_US
dc.contributor.author	Wu, D	en_US
dc.date.issued	2014-01-01	en_US
dc.identifier.citation	Procedia Engineering, 2014, 81 pp. 1011 - 1016	en_US
dc.identifier.uri	http://hdl.handle.net/10453/35280
dc.description.abstract	© 2014 The Authors. Published by Elsevier Ltd. With the development of microforming technology, the demand on accuracy of the metallic micro components is elevating. While springback phenomenon which is inevitable during bending process, can cause unpredicted dimensional error, bringing difficulties to the downstream assembly, and let alone the springback in microforming as the measurements of tools and workpieces downsize hundreds even thousands times. This paper focuses on the springback effect that occurs after the micro Vbending a classic processing method to manufacture microparts. Numerical simulation has been conducted to investigate the size effect in terms of Voronoi tessellation and springback. A finite element (FE) model of the micro V-bending has been established by utilising ABAQUS/Standard commercial software. The grain sizes of 98, 152 and 201 μm have been adopted in FE model to study the relationship between the size effect and springback angle during the V-bending process.	en_US
dc.relation.ispartof	Procedia Engineering	en_US
dc.relation.isbasedon	10.1016/j.proeng.2014.10.133	en_US
dc.title	Numerical study on springback with size effect in micro V-bending	en_US
dc.type	Journal Article
utslib.citation.volume	81	en_US
utslib.for	0910 Manufacturing Engineering	en_US
utslib.for	09 Engineering	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Mechanical and Mechatronic Engineering
utslib.copyright.status	open_access
pubs.publication-status	Published	en_US
pubs.volume	81	en_US

Abstract:

© 2014 The Authors. Published by Elsevier Ltd. With the development of microforming technology, the demand on accuracy of the metallic micro components is elevating. While springback phenomenon which is inevitable during bending process, can cause unpredicted dimensional error, bringing difficulties to the downstream assembly, and let alone the springback in microforming as the measurements of tools and workpieces downsize hundreds even thousands times. This paper focuses on the springback effect that occurs after the micro Vbending a classic processing method to manufacture microparts. Numerical simulation has been conducted to investigate the size effect in terms of Voronoi tessellation and springback. A finite element (FE) model of the micro V-bending has been established by utilising ABAQUS/Standard commercial software. The grain sizes of 98, 152 and 201 μm have been adopted in FE model to study the relationship between the size effect and springback angle during the V-bending process.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/35280