Browsing byAuthorGeisler, H
Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
2012-10-01 | Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures | Hsing, A; Geisler, H; Ryan, V; Cheng, M; MacHani, K; Breuer, D; Lehr, MU; Paul, J; Iacopi, F; Dauskardt, R |
2013-06-01 | Nanoindentation for reliability assessment of ULK films and interconnects structures | Yeap, KB; Iacopi, F; Geisler, H; Hangen, U; Zschech, E |