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Showing results 5 to 6 of 6
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Issue Date
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2022-07-01
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit
Wang, N
;
Yang, J
;
Ding, C
;
Jia, HZ
;
Zhai, JH
2019-11-01
A Thermal Management System to Reuse Thermal Waste Released by High-Power Light-Emitting Diodes
Wang, N
;
Gao, C
;
Ding, C
;
Jia, HZ
;
Sui, GR
;
Gao, XM