Browsing byAuthorBreuer, D
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| Issue Date | Title | Author(s) |
|---|---|---|
| 2012-10-01 | Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures | Hsing, A; Geisler, H; Ryan, V; Cheng, M; MacHani, K; Breuer, D; Lehr, MU; Paul, J; Iacopi, F; Dauskardt, R |