Dynamic X-ray testing in electronics production - Application of data mining techniques for quality prediction

Deuse, J; Schmitt, J; Bönig, J; Beitinger, G

Dynamic X-ray testing in electronics production - Application of data mining techniques for quality prediction

Deuse, J

Schmitt, J Bönig, J Beitinger, G

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Publisher:: Walter de Gruyter GmbH
Publication Type:: Journal Article
Citation:: ZWF Zeitschrift fuer Wirtschaftlichen Fabrikbetrieb, 2019, 114, (5), pp. 264-267
Issue Date:: 2019-05-01

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Field	Value	Language
dc.contributor.author	Deuse, J https://orcid.org/0000-0003-4066-4357
dc.contributor.author	Schmitt, J
dc.contributor.author	Bönig, J
dc.contributor.author	Beitinger, G
dc.date.accessioned	2022-10-06T03:15:13Z
dc.date.available	2022-10-06T03:15:13Z
dc.date.issued	2019-05-01
dc.identifier.citation	ZWF Zeitschrift fuer Wirtschaftlichen Fabrikbetrieb, 2019, 114, (5), pp. 264-267
dc.identifier.issn	0947-0085
dc.identifier.issn	2511-0896
dc.identifier.uri	http://hdl.handle.net/10453/162349
dc.description.abstract	This paper presents a concept for dynamic X-ray testing in electronics manufacturing that allows the prediction of final product quality in the running process by evaluating process data using data mining techniques. This enables the reduction of X-ray testing volumes through the development of dynamic inspection plans.
dc.language	en
dc.publisher	Walter de Gruyter GmbH
dc.relation.ispartof	ZWF Zeitschrift fuer Wirtschaftlichen Fabrikbetrieb
dc.relation.isbasedon	10.3139/104.112069
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject.classification	Industrial Engineering & Automation
dc.title	Dynamic X-ray testing in electronics production - Application of data mining techniques for quality prediction
dc.type	Journal Article
utslib.citation.volume	114
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology
pubs.organisational-group	/University of Technology Sydney/Faculty of Engineering and Information Technology/School of Mechanical and Mechatronic Engineering
utslib.copyright.status	closed_access	*
dc.date.updated	2022-10-06T03:15:12Z
pubs.issue	5
pubs.publication-status	Published
pubs.volume	114
utslib.citation.issue	5

Abstract:

This paper presents a concept for dynamic X-ray testing in electronics manufacturing that allows the prediction of final product quality in the running process by evaluating process data using data mining techniques. This enables the reduction of X-ray testing volumes through the development of dynamic inspection plans.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/162349