Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film

Yang, CC-L; Lau, JH; Peng, AY-J; Teng, V; Chen, GC-F; Huang, JY-C; Chen, YH; Liu, H-N; Tseng, T-J; Li, M

Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film

Yang, CC-L Lau, JH Peng, AY-J Teng, V Chen, GC-F Huang, JY-C Chen, YH Liu, H-N Tseng, T-J Li, M

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Publisher:: IEEE
Publication Type:: Conference Proceeding
Citation:: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, 00, pp. 542-547
Issue Date:: 2023

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Field	Value	Language
dc.contributor.author	Yang, CC-L
dc.contributor.author	Lau, JH
dc.contributor.author	Peng, AY-J
dc.contributor.author	Teng, V
dc.contributor.author	Chen, GC-F
dc.contributor.author	Huang, JY-C
dc.contributor.author	Chen, YH
dc.contributor.author	Liu, H-N
dc.contributor.author	Tseng, T-J
dc.contributor.author	Li, M
dc.date	2023-05-30
dc.date.accessioned	2024-05-13T01:47:28Z
dc.date.available	2024-05-13T01:47:28Z
dc.date.issued	2023
dc.identifier.citation	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, 00, pp. 542-547
dc.identifier.issn	0569-5503
dc.identifier.issn	2377-5726
dc.identifier.uri	http://hdl.handle.net/10453/178880
dc.description.abstract	The hybrid substrate build up package substrate organic interposer solder joints underfill of 2 3D IC integration or multiple systems and heterogeneous integration is investigated The organic interposer of the hybrid substrate is fabricated by a fan out chip last on a temporary panel with two different kinds of dielectric materials namely the PID photoimageable dielectric and the ABF Ajinomoto Build Up Film These two hybrid substrates are supporting two chips The flatness of metal lines of the RDLs redistribution layers the quality of the hybrid substrate after chip to hybrid substrate bonding and the reliability of the solder joints between these two hybrid substrates will be presented
dc.language	en
dc.publisher	IEEE
dc.relation.ispartof	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.relation.ispartof	2023 IEEE 73rd Electronic Components and Technology Conference
dc.relation.ispartofseries	Electronic Components and Technology Conference
dc.relation.isbasedon	10.1109/ectc51909.2023.00097
dc.rights	info:eu-repo/semantics/closedAccess
dc.title	Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film
dc.type	Conference Proceeding
utslib.citation.volume	00
utslib.location.activity	Orlando, FL, USA
utslib.copyright.status	closed_access	*
dc.date.updated	2024-05-13T01:47:27Z
pubs.finish-date	2023-06-02
pubs.publication-status	Published
pubs.start-date	2023-05-30
pubs.volume	00

Abstract:

The hybrid substrate build up package substrate organic interposer solder joints underfill of 2 3D IC integration or multiple systems and heterogeneous integration is investigated The organic interposer of the hybrid substrate is fabricated by a fan out chip last on a temporary panel with two different kinds of dielectric materials namely the PID photoimageable dielectric and the ABF Ajinomoto Build Up Film These two hybrid substrates are supporting two chips The flatness of metal lines of the RDLs redistribution layers the quality of the hybrid substrate after chip to hybrid substrate bonding and the reliability of the solder joints between these two hybrid substrates will be presented

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http://hdl.handle.net/10453/178880