A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation
Yang, Y
Yin, Z
Zhu, X
Jamal, HA
Lv, X
Hu, K
Joshi, M
Wille, N
Li, M
Zhang, B
Luo, Z
Magdassi, S
Tentzeris, M
- Publisher:
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Publication Type:
- Journal Article
- Citation:
- Proceedings of the IEEE, 2024, 112, (8), pp. 954-999
- Issue Date:
- 2024-01-01
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Full metadata record
Field | Value | Language |
---|---|---|
dc.contributor.author |
Yang, Y https://orcid.org/0000-0001-7439-2156 |
|
dc.contributor.author |
Yin, Z https://orcid.org/0000-0002-3883-7354 |
|
dc.contributor.author | Zhu, X | |
dc.contributor.author | Jamal, HA | |
dc.contributor.author | Lv, X | |
dc.contributor.author | Hu, K | |
dc.contributor.author | Joshi, M | |
dc.contributor.author | Wille, N | |
dc.contributor.author | Li, M | |
dc.contributor.author | Zhang, B | |
dc.contributor.author |
Luo, Z https://orcid.org/0000-0002-6953-3986 |
|
dc.contributor.author | Magdassi, S | |
dc.contributor.author | Tentzeris, M | |
dc.date.accessioned | 2024-12-02T01:49:27Z | |
dc.date.available | 2024-12-02T01:49:27Z | |
dc.date.issued | 2024-01-01 | |
dc.identifier.citation | Proceedings of the IEEE, 2024, 112, (8), pp. 954-999 | |
dc.identifier.issn | 0018-9219 | |
dc.identifier.issn | 1558-2256 | |
dc.identifier.uri | http://hdl.handle.net/10453/182288 | |
dc.description.abstract | Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing. | |
dc.language | English | |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
dc.relation | http://purl.org/au-research/grants/arc/LE220100035 | |
dc.relation.ispartof | Proceedings of the IEEE | |
dc.relation.isbasedon | 10.1109/JPROC.2024.3471849 | |
dc.rights | info:eu-repo/semantics/openAccess | |
dc.subject | 0801 Artificial Intelligence and Image Processing, 0903 Biomedical Engineering, 0906 Electrical and Electronic Engineering | |
dc.subject.classification | 4009 Electronics, sensors and digital hardware | |
dc.title | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation | |
dc.type | Journal Article | |
utslib.citation.volume | 112 | |
utslib.for | 0801 Artificial Intelligence and Image Processing | |
utslib.for | 0903 Biomedical Engineering | |
utslib.for | 0906 Electrical and Electronic Engineering | |
pubs.organisational-group | University of Technology Sydney | |
pubs.organisational-group | University of Technology Sydney/Faculty of Engineering and Information Technology | |
pubs.organisational-group | University of Technology Sydney/Faculty of Engineering and Information Technology/School of Mechanical and Mechatronic Engineering | |
pubs.organisational-group | University of Technology Sydney/Faculty of Engineering and Information Technology/School of Electrical and Data Engineering | |
pubs.organisational-group | University of Technology Sydney/UTS Groups | |
pubs.organisational-group | University of Technology Sydney/UTS Groups/Centre for Advanced Manufacturing (CAM) | |
pubs.organisational-group | University of Technology Sydney/UTS Groups/Centre for Audio, Acoustics and Vibration (CAAV) | |
pubs.organisational-group | University of Technology Sydney/UTS Groups/Centre for Audio, Acoustics and Vibration (CAAV)/Centre for Audio, Acoustics and Vibration (CAAV) Associate Members | |
utslib.copyright.status | open_access | * |
dc.rights.license | This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0). To view a copy of this license, visit https://creativecommons.org/licenses/by/4.0/ | |
dc.date.updated | 2024-12-02T01:49:25Z | |
pubs.issue | 8 | |
pubs.publication-status | Published | |
pubs.volume | 112 | |
utslib.citation.issue | 8 |
Abstract:
Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.
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