Thermal Conductivity of BN-Based Polymer Composites for Thermal Interface Management: Progress and Applications

Rehman, MU; Maqsood, MF; Sajjad, L; Nadeem, A; Elahi, E; Assiri, MA; Khan, K; Rehman, S; Rehman, MA; Cheng, Q; Khan, MF

Thermal Conductivity of BN-Based Polymer Composites for Thermal Interface Management: Progress and Applications

Rehman, MU Maqsood, MF Sajjad, L Nadeem, A Elahi, E Assiri, MA Khan, K

Rehman, S Rehman, MA Cheng, Q Khan, MF

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Publisher:: WILEY
Publication Type:: Journal Article
Citation:: International Journal of Energy Research, 2025, 2025, (1)
Issue Date:: 2025-01-01

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Field	Value	Language
dc.contributor.author	Rehman, MU
dc.contributor.author	Maqsood, MF
dc.contributor.author	Sajjad, L
dc.contributor.author	Nadeem, A
dc.contributor.author	Elahi, E
dc.contributor.author	Assiri, MA
dc.contributor.author	Khan, K https://orcid.org/0000-0001-8689-9245
dc.contributor.author	Rehman, S
dc.contributor.author	Rehman, MA
dc.contributor.author	Cheng, Q
dc.contributor.author	Khan, MF
dc.contributor.editor	Sun, C
dc.date.accessioned	2026-02-19T03:58:30Z
dc.date.available	2026-02-19T03:58:30Z
dc.date.issued	2025-01-01
dc.identifier.citation	International Journal of Energy Research, 2025, 2025, (1)
dc.identifier.issn	0363-907X
dc.identifier.issn	1099-114X
dc.identifier.uri	http://hdl.handle.net/10453/193635
dc.description.abstract	Advanced electronic technology significantly relies on the superior heat-conducting materials to efficiently manage the heat generated by circuit assemblies. Effective thermal management is essential to ensure the reliability, efficiency, and durability of electronic devices. The thermal conductivity (TC) of polymers can be improved by initiating several nanofillers and constructing a three-dimensional (3D) conductive path for phonon transfer. In this review, we discussed the synthesis of boron nitride (BN), the thermal characteristics of BN, and BN filler in polymer matrix for enhanced TC. It is summarized that the TC of the polymer composites could be enhanced in case when matrix is added with BN nanosheets (BNNSs) through bidirectional freezing, hot pressing, roll cutting, and making the 3D structure of reinforcement, making it suitable for the applications of electronic packaging. Also, hybrid fillers such as short carbon fiber, BN nanotubes (BNNTs), and nanosheets may construct a highly conductive path for phonon transfer. In addition, we highlighted the challenges and provided the prospects of BN nanostructures in various applications of thermal management to enhance the functional capability of equipment and electronic gadgets.
dc.language	English
dc.publisher	WILEY
dc.relation.ispartof	International Journal of Energy Research
dc.relation.isbasedon	10.1155/er/1963336
dc.rights	info:eu-repo/semantics/openAccess
dc.subject	0904 Chemical Engineering, 0906 Electrical and Electronic Engineering, 0913 Mechanical Engineering
dc.subject.classification	Energy
dc.subject.classification	4008 Electrical engineering
dc.title	Thermal Conductivity of BN-Based Polymer Composites for Thermal Interface Management: Progress and Applications
dc.type	Journal Article
utslib.citation.volume	2025
utslib.for	0904 Chemical Engineering
utslib.for	0906 Electrical and Electronic Engineering
utslib.for	0913 Mechanical Engineering
pubs.organisational-group	University of Technology Sydney
pubs.organisational-group	University of Technology Sydney/Faculty of Science
pubs.organisational-group	University of Technology Sydney/UTS Groups
pubs.organisational-group	University of Technology Sydney/UTS Groups/Centre for Clean Energy Technology (CCET)
pubs.organisational-group	University of Technology Sydney/UTS Groups/Centre for Clean Energy Technology (CCET)/Centre for Clean Energy Technology (CCET) Associate Members
pubs.organisational-group	University of Technology Sydney/Faculty of Science/Science Related HDR Students
utslib.copyright.status	open_access	*
dc.rights.license	This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0). To view a copy of this license, visit https://creativecommons.org/licenses/by/4.0/
dc.date.updated	2026-02-19T03:58:28Z
pubs.issue	1
pubs.publication-status	Published
pubs.volume	2025
utslib.citation.issue	1

Abstract:

Advanced electronic technology significantly relies on the superior heat-conducting materials to efficiently manage the heat generated by circuit assemblies. Effective thermal management is essential to ensure the reliability, efficiency, and durability of electronic devices. The thermal conductivity (TC) of polymers can be improved by initiating several nanofillers and constructing a three-dimensional (3D) conductive path for phonon transfer. In this review, we discussed the synthesis of boron nitride (BN), the thermal characteristics of BN, and BN filler in polymer matrix for enhanced TC. It is summarized that the TC of the polymer composites could be enhanced in case when matrix is added with BN nanosheets (BNNSs) through bidirectional freezing, hot pressing, roll cutting, and making the 3D structure of reinforcement, making it suitable for the applications of electronic packaging. Also, hybrid fillers such as short carbon fiber, BN nanotubes (BNNTs), and nanosheets may construct a highly conductive path for phonon transfer. In addition, we highlighted the challenges and provided the prospects of BN nanostructures in various applications of thermal management to enhance the functional capability of equipment and electronic gadgets.

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http://hdl.handle.net/10453/193635