Patterning of electrodes for mechanically robust and bendable lithium-ion batteries

Choi, S; Lee, JI; Park, S

Patterning of electrodes for mechanically robust and bendable lithium-ion batteries

Choi, S Lee, JI Park, S

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Publication Type:: Journal Article
Citation:: Journal of Materials Chemistry, 2012, 22 (42), pp. 22366 - 22369
Issue Date:: 2012-11-14

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Field	Value	Language
dc.contributor.author	Choi, S	en_US
dc.contributor.author	Lee, JI	en_US
dc.contributor.author	Park, S	en_US
dc.date.issued	2012-11-14	en_US
dc.identifier.citation	Journal of Materials Chemistry, 2012, 22 (42), pp. 22366 - 22369	en_US
dc.identifier.issn	0959-9428	en_US
dc.identifier.uri	http://hdl.handle.net/10453/115061
dc.description.abstract	We demonstrate a simple route for fabricating trench-type copper patterns by combining a photo-lithography with a wet etching process. Nanostructured CuO was grown on the patterned Cu current collectors via a simple solution immersion process. And silicon nanoparticles were filled into the patterned Cu current collectors. The strongly immobilized CuO on the patterned Cu exhibited high electrochemical performance, including a high reversible capacity and a high rate capability. © 2012 The Royal Society of Chemistry.	en_US
dc.relation.ispartof	Journal of Materials Chemistry	en_US
dc.relation.isbasedon	10.1039/c2jm34626e	en_US
dc.subject.classification	Nanoscience & Nanotechnology	en_US
dc.title	Patterning of electrodes for mechanically robust and bendable lithium-ion batteries	en_US
dc.type	Journal Article
utslib.citation.volume	42	en_US
utslib.citation.volume	22	en_US
utslib.for	0302 Inorganic Chemistry	en_US
utslib.for	0912 Materials Engineering	en_US
utslib.for	03 Chemical Sciences	en_US
utslib.for	09 Engineering	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Science
pubs.organisational-group	/University of Technology Sydney/Faculty of Science/School of Mathematical and Physical Sciences
pubs.organisational-group	/University of Technology Sydney/Strength - CCET - Centre for Clean Energy Technology
utslib.copyright.status	closed_access
pubs.issue	42	en_US
pubs.publication-status	Published	en_US
pubs.volume	22	en_US

Abstract:

We demonstrate a simple route for fabricating trench-type copper patterns by combining a photo-lithography with a wet etching process. Nanostructured CuO was grown on the patterned Cu current collectors via a simple solution immersion process. And silicon nanoparticles were filled into the patterned Cu current collectors. The strongly immobilized CuO on the patterned Cu exhibited high electrochemical performance, including a high reversible capacity and a high rate capability. © 2012 The Royal Society of Chemistry.

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http://hdl.handle.net/10453/115061