Sulfur ligand mediated electrochemistry of gold surfaces and nanoparticles: What, how, and why

Publication Type:
Journal Article
Current Opinion in Electrochemistry, 2017, 1 (1), pp. 7 - 15
Issue Date:
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© 2017 Gold surfaces are widely used in electrochemistry while gold nanoparticles have very many uses, with both the surfaces and the particles often being protected by sulfur-bound organic ligands. The ligands not only provide chemical stability but also directly participate in many desired processes. This review considers the diversity of known atomic structures for gold–sulfur interfaces, how these structures facilitate a diversity of mechanisms in electrochemical applications, and why this is possible based on recent advances in the basic understanding of the electronic structure of gold–sulfur bonds. Believed once to be Au(I)-thiolate in character and hence distinctly different to physisorbed thiols and disulfides, chemisorbed bonds are shown to be Au(0)-thiyls instead. A wide range of in situ STM electrochemical and other data is interpreted from this perspective.
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