Sulfur ligand mediated electrochemistry of gold surfaces and nanoparticles: What, how, and why

Chi, Q; Ford, MJ; Halder, A; Hush, NS; Reimers, JR; Ulstrup, J

Sulfur ligand mediated electrochemistry of gold surfaces and nanoparticles: What, how, and why

Chi, Q Ford, MJ

Halder, A Hush, NS Reimers, JR

Ulstrup, J

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Publication Type:: Journal Article
Citation:: Current Opinion in Electrochemistry, 2017, 1 (1), pp. 7 - 15
Issue Date:: 2017-02-01

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Field	Value	Language
dc.contributor.author	Chi, Q	en_US
dc.contributor.author	Ford, MJ https://orcid.org/0000-0002-8595-5900	en_US
dc.contributor.author	Halder, A	en_US
dc.contributor.author	Hush, NS	en_US
dc.contributor.author	Reimers, JR https://orcid.org/0000-0001-5157-7422	en_US
dc.contributor.author	Ulstrup, J	en_US
dc.date.available	2020-05-25T19:23:50Z
dc.date.issued	2017-02-01	en_US
dc.identifier.citation	Current Opinion in Electrochemistry, 2017, 1 (1), pp. 7 - 15	en_US
dc.identifier.issn	2451-9103	en_US
dc.identifier.uri	http://hdl.handle.net/10453/125273
dc.description.abstract	© 2017 Gold surfaces are widely used in electrochemistry while gold nanoparticles have very many uses, with both the surfaces and the particles often being protected by sulfur-bound organic ligands. The ligands not only provide chemical stability but also directly participate in many desired processes. This review considers the diversity of known atomic structures for gold–sulfur interfaces, how these structures facilitate a diversity of mechanisms in electrochemical applications, and why this is possible based on recent advances in the basic understanding of the electronic structure of gold–sulfur bonds. Believed once to be Au(I)-thiolate in character and hence distinctly different to physisorbed thiols and disulfides, chemisorbed bonds are shown to be Au(0)-thiyls instead. A wide range of in situ STM electrochemical and other data is interpreted from this perspective.	en_US
dc.relation.ispartof	Current Opinion in Electrochemistry	en_US
dc.relation.isbasedon	10.1016/j.coelec.2016.12.004	en_US
dc.title	Sulfur ligand mediated electrochemistry of gold surfaces and nanoparticles: What, how, and why	en_US
dc.type	Journal Article
utslib.citation.volume	1	en_US
utslib.for	0399 Other Chemical Sciences	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/DVC (Research)
pubs.organisational-group	/University of Technology Sydney/Faculty of Science
pubs.organisational-group	/University of Technology Sydney/Faculty of Science/School of Mathematical and Physical Sciences
utslib.copyright.status	open_access
pubs.issue	1	en_US
pubs.publication-status	Published	en_US
pubs.volume	1	en_US

Abstract:

© 2017 Gold surfaces are widely used in electrochemistry while gold nanoparticles have very many uses, with both the surfaces and the particles often being protected by sulfur-bound organic ligands. The ligands not only provide chemical stability but also directly participate in many desired processes. This review considers the diversity of known atomic structures for gold–sulfur interfaces, how these structures facilitate a diversity of mechanisms in electrochemical applications, and why this is possible based on recent advances in the basic understanding of the electronic structure of gold–sulfur bonds. Believed once to be Au(I)-thiolate in character and hence distinctly different to physisorbed thiols and disulfides, chemisorbed bonds are shown to be Au(0)-thiyls instead. A wide range of in situ STM electrochemical and other data is interpreted from this perspective.

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http://hdl.handle.net/10453/125273