Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes

Martin, AA; Bishop, J; Burnett, W; Alfonso, N; Kong, C; Forsman, A; Carlson, L; Rice, NG; Stadermann, M; Toth, M; Bunn, TL

Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes

Martin, AA Bishop, J

Burnett, W Alfonso, N Kong, C Forsman, A Carlson, L Rice, NG Stadermann, M Toth, M

Bunn, TL

Permalink

Publisher:: Elsevier BV
Publication Type:: Journal Article
Citation:: Diamond and Related Materials, 2020, 105
Issue Date:: 2020-05-01

Closed Access

	Filename	Description	Size
	1-s2.0-S0925963519309914-main.pdf	Published version	1.08 MB	Adobe PDF	View/Open

Copyright Clearance Process

Recently Added
In Progress
Closed Access

This item is closed access and not available.

Full metadata record

Field	Value	Language
dc.contributor.author	Martin, AA
dc.contributor.author	Bishop, J https://orcid.org/0000-0001-6895-7544
dc.contributor.author	Burnett, W
dc.contributor.author	Alfonso, N
dc.contributor.author	Kong, C
dc.contributor.author	Forsman, A
dc.contributor.author	Carlson, L
dc.contributor.author	Rice, NG
dc.contributor.author	Stadermann, M
dc.contributor.author	Toth, M https://orcid.org/0000-0003-1564-4899
dc.contributor.author	Bunn, TL
dc.date.accessioned	2020-10-19T05:01:36Z
dc.date.available	2020-10-19T05:01:36Z
dc.date.issued	2020-05-01
dc.identifier.citation	Diamond and Related Materials, 2020, 105
dc.identifier.issn	0925-9635
dc.identifier.issn	0925-9635
dc.identifier.uri	http://hdl.handle.net/10453/143366
dc.description.abstract	© 2020 Microfabrication techniques are critical for the rapid prototyping and development of applications for cutting edge materials. Recently diamond has gained considerable interest for quantum photonic, biosensing, inertial confinement fusion and magnetometer applications. In this article, ultra-high aspect ratio milling of diamond micropores by photon, ion and electron based methods is reported. A multiphoton absorption laser ablation approach is revealed to rapidly produce sub-10 μm diameter micropores in diamond with an aspect ratio of 14:1 and a tapered profile at the surface interface. Chemically active, oxygen focused ion beam milling produces high-aspect ratio pores in diamond with an aspect ratio of 65:1 and minimal tapering over the length of the pore, overcoming the physical interaction volume limitations imposed in conventional gallium based focused ion beam milling and laser ablation methods. Oxygen-mediated electron beam induced etching is revealed to negate the limitations imposed by physical sputtering mechanisms utilized in focused ion beam milling via the direct initiation of chemical reactions at the receding surface, producing aspect ratios on the order of 200:1. Numerical simulations reveal the physical basis for the superior aspect-ratio pore milling of the oxygen focused ion beam milling and electron beam induced etching methods. Our results demonstrate direct-write methods for the fabrication of ultra-high aspect micropores in diamond and provide insight into the underlying mechanisms of these physical processes. The three methods demonstrated here can be interchanged for applications based on the desired characteristic aspect ratio and process throughput.
dc.language	en
dc.publisher	Elsevier BV
dc.relation	http://purl.org/au-research/grants/arc/DP160101301
dc.relation.ispartof	Diamond and Related Materials
dc.relation.isbasedon	10.1016/j.diamond.2020.107806
dc.rights	info:eu-repo/semantics/restrictedAccess
dc.subject	0904 Chemical Engineering, 0910 Manufacturing Engineering, 0912 Materials Engineering
dc.subject.classification	Applied Physics
dc.title	Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes
dc.type	Journal Article
utslib.citation.volume	105
utslib.for	0904 Chemical Engineering
utslib.for	0910 Manufacturing Engineering
utslib.for	0912 Materials Engineering
pubs.organisational-group	/University of Technology Sydney/Faculty of Science
pubs.organisational-group	/University of Technology Sydney/Faculty of Science/School of Mathematical and Physical Sciences
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Strength - MTEE - Research Centre Materials and Technology for Energy Efficiency
utslib.copyright.status	closed_access	*
pubs.consider-herdc	false
dc.date.updated	2020-10-19T05:01:30Z
pubs.publication-status	Published
pubs.volume	105

Abstract:

© 2020 Microfabrication techniques are critical for the rapid prototyping and development of applications for cutting edge materials. Recently diamond has gained considerable interest for quantum photonic, biosensing, inertial confinement fusion and magnetometer applications. In this article, ultra-high aspect ratio milling of diamond micropores by photon, ion and electron based methods is reported. A multiphoton absorption laser ablation approach is revealed to rapidly produce sub-10 μm diameter micropores in diamond with an aspect ratio of 14:1 and a tapered profile at the surface interface. Chemically active, oxygen focused ion beam milling produces high-aspect ratio pores in diamond with an aspect ratio of 65:1 and minimal tapering over the length of the pore, overcoming the physical interaction volume limitations imposed in conventional gallium based focused ion beam milling and laser ablation methods. Oxygen-mediated electron beam induced etching is revealed to negate the limitations imposed by physical sputtering mechanisms utilized in focused ion beam milling via the direct initiation of chemical reactions at the receding surface, producing aspect ratios on the order of 200:1. Numerical simulations reveal the physical basis for the superior aspect-ratio pore milling of the oxygen focused ion beam milling and electron beam induced etching methods. Our results demonstrate direct-write methods for the fabrication of ultra-high aspect micropores in diamond and provide insight into the underlying mechanisms of these physical processes. The three methods demonstrated here can be interchanged for applications based on the desired characteristic aspect ratio and process throughput.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/143366