Fabrication of planarised conductively patterned diamond for bio-applications

Tong, W; Fox, K; Ganesan, K; Turnley, AM; Shimoni, O; Tran, PA; Lohrmann, A; McFarlane, T; Ahnood, A; Garrett, DJ; Meffin, H; O'Brien-Simpson, NM; Reynolds, EC; Prawer, S

Fabrication of planarised conductively patterned diamond for bio-applications

Tong, W Fox, K Ganesan, K Turnley, AM Shimoni, O

Tran, PA Lohrmann, A McFarlane, T Ahnood, A Garrett, DJ Meffin, H O'Brien-Simpson, NM Reynolds, EC Prawer, S

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Publication Type:: Journal Article
Citation:: Materials Science and Engineering C, 2014, 43 pp. 135 - 144
Issue Date:: 2014-10-01

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Field	Value	Language
dc.contributor.author	Tong, W	en_US
dc.contributor.author	Fox, K	en_US
dc.contributor.author	Ganesan, K	en_US
dc.contributor.author	Turnley, AM	en_US
dc.contributor.author	Shimoni, O https://orcid.org/0000-0001-8822-1024	en_US
dc.contributor.author	Tran, PA	en_US
dc.contributor.author	Lohrmann, A	en_US
dc.contributor.author	McFarlane, T	en_US
dc.contributor.author	Ahnood, A	en_US
dc.contributor.author	Garrett, DJ	en_US
dc.contributor.author	Meffin, H	en_US
dc.contributor.author	O'Brien-Simpson, NM	en_US
dc.contributor.author	Reynolds, EC	en_US
dc.contributor.author	Prawer, S	en_US
dc.date.available	2014-07-03	en_US
dc.date.issued	2014-10-01	en_US
dc.identifier.citation	Materials Science and Engineering C, 2014, 43 pp. 135 - 144	en_US
dc.identifier.issn	0928-4931	en_US
dc.identifier.uri	http://hdl.handle.net/10453/30436
dc.description.abstract	The development of smooth, featureless surfaces for biomedical microelectronics is a challenging feat. Other than the traditional electronic materials like silicon, few microelectronic circuits can be produced with conductive features without compromising the surface topography and/or biocompatibility. Diamond is fast becoming a highly sought after biomaterial for electrical stimulation, however, its inherent surface roughness introduced by the growth process limits its applications in electronic circuitry. In this study, we introduce a fabrication method for developing conductive features in an insulating diamond substrate whilst maintaining a planar topography. Using a combination of microwave plasma enhanced chemical vapour deposition, inductively coupled plasma reactive ion etching, secondary diamond growth and silicon wet-etching, we have produced a patterned substrate in which the surface roughness at the interface between the conducting and insulating diamond is approximately 3 nm. We also show that the patterned smooth topography is capable of neuronal cell adhesion and growth whilst restricting bacterial adhesion. © 2014 Elsevier B.V.	en_US
dc.relation.ispartof	Materials Science and Engineering C	en_US
dc.relation.isbasedon	10.1016/j.msec.2014.07.016	en_US
dc.subject.classification	Biomedical Engineering	en_US
dc.subject.mesh	Diamond	en_US
dc.subject.mesh	Biocompatible Materials	en_US
dc.subject.mesh	Anti-Bacterial Agents	en_US
dc.subject.mesh	Microscopy, Electron, Scanning	en_US
dc.subject.mesh	Microscopy, Atomic Force	en_US
dc.subject.mesh	Spectrum Analysis	en_US
dc.subject.mesh	Microbial Sensitivity Tests	en_US
dc.subject.mesh	Electric Stimulation	en_US
dc.subject.mesh	Surface Properties	en_US
dc.title	Fabrication of planarised conductively patterned diamond for bio-applications	en_US
dc.type	Journal Article
utslib.citation.volume	43	en_US
utslib.for	0903 Biomedical Engineering	en_US
utslib.for	0912 Materials Engineering	en_US
pubs.embargo.period	Not known	en_US
pubs.organisational-group	/University of Technology Sydney
pubs.organisational-group	/University of Technology Sydney/Faculty of Science
pubs.organisational-group	/University of Technology Sydney/Faculty of Science/School of Mathematical and Physical Sciences
pubs.organisational-group	/University of Technology Sydney/Strength - IBMD - Initiative for Biomedical Devices
utslib.copyright.status	closed_access
pubs.publication-status	Published	en_US
pubs.volume	43	en_US

Abstract:

The development of smooth, featureless surfaces for biomedical microelectronics is a challenging feat. Other than the traditional electronic materials like silicon, few microelectronic circuits can be produced with conductive features without compromising the surface topography and/or biocompatibility. Diamond is fast becoming a highly sought after biomaterial for electrical stimulation, however, its inherent surface roughness introduced by the growth process limits its applications in electronic circuitry. In this study, we introduce a fabrication method for developing conductive features in an insulating diamond substrate whilst maintaining a planar topography. Using a combination of microwave plasma enhanced chemical vapour deposition, inductively coupled plasma reactive ion etching, secondary diamond growth and silicon wet-etching, we have produced a patterned substrate in which the surface roughness at the interface between the conducting and insulating diamond is approximately 3 nm. We also show that the patterned smooth topography is capable of neuronal cell adhesion and growth whilst restricting bacterial adhesion. © 2014 Elsevier B.V.

Please use this identifier to cite or link to this item:

http://hdl.handle.net/10453/30436